This reliable Diamond Scriber performs fast, easy and precise scribing and cutting of silicon wafers, as well as thin- and thick film ceramic and glass substrates. It forms the grooves necessary for effective glass or ceramic cutting: shallow, even and coninuous. All essential operating parameter - the angle of the scribing tool, the scribing force, the touchdown point and the lift up point of the tool are precisely adjustable to ensure optimal flexibility and repeatable results. The scriber has got a rotatting X-Y table with universal vacuum chuck for any size wafers up to 8" dia or ceramic substrates up to 8" x8 ".
The X adjustment is performed by a precision ball screw with a digital readout +/- 10 µm. The table with chuck is moveable in the Y-(scribing) direction by hand. The scribing tool touches down the substrate or wafer surface on an adjustable touchdown point and is automatically lifted after leaving the scribing area. The lift-up point is adjustable too. The lowering and lifting of the tool can also be performed manually. A 50x magnification Microscope with cross hair and coaxial illumination can be aligned with the trace of the diamond so that the paths of the wafer or substrate, where the cut has to be performed, need to be aligned with the cross hair of the microscope.