Anwendungen und Prozesse:

  • MEMS package sealing with getter activation
  • Rapid Thermal Annealing/Processing
  • Solder Bump Reflow with Plasma pre-cleaning
  • Reflow Soldering, voidfree, fluxless and leadfree
  • Baking and curing of photoresists
  • Sensitive BCB Curing
  • AuGe/SiAu alloying
  • Flip-Chip soldering
  • Package lead sealing
  • Laser/RF/power die attachmentRapid Thermal Processing of Solar Cells by Silicon Wafer Bonding on low cost substratesProcessing of high efficiency silicon solar cells by bonding to borosilicate glass