Reflow Solder Systems

We offer different kind of table top and space saving systems (for R&D use, for prototyping and small series production)

  • RSO: Reflow Solder Oven RSO-200 (up to 650 °C)
  • RSS: Mini Reflow Solder System RSS-110-S, RSS-160-S, RSS-210-S (max. temp. 400 °C)
  • RVS-210: Reflow Vacuum Solder System up to 400 °C also for flux
  • VSS: Vacuum Solder System (up to 400 °C) also for flux

RSS-110-S

Mini Vacuum Reflow System with SIMATIC© control for substrate size up 100 x 100 mm

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RSS-160-S

Mini Vacuum Reflow System with SIMATIC© control for substrate size up 160 x 160 mm

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RSS 3X210-S

Vacuum Reflow System with SIMATIC© control for substrate size up to 3 x (200 x 200 mm) Lift pins for wafer lift up and down

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RSS-210-S

Vacuum Reflow System with SIMATIC© control for substrate size up 200 x 200 mm

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RVS-210

Reflow Vacuum Solder System also for flux and other contaminating material up to 200 x 200mm substrate size

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VSS-450-300

Vacuum Reflow Solder System for up to 300 x 300 mm substrate size

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2Z-HVS-100 2 zone high vacuum sealer with getter activation

customer specific adapters possible

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2Z-HVS-200 2 zone high vacuum sealer with getter activation

customer specific adapters possible

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RSO-200

Reflow Solder oven for substrate size up to 200 x 170 mm up to 650 °C

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RSO-200-HV

High vacuum reflow solder oven for up to 200 x 170 mm substrate size up to 650 °C

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