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RSO-200

Reflow Solder OvenTechnical Data RSO-200:

  • Loading area (max. part size): 200x170x40mm (WxDxH)
  • Quartz glass process chamber (fix mounted), incl. graphite susceptor
  • with integrated gas- in- and outlet
  • 1 Mass Flow Controller für Nitrogen 5 nlm is standard
  • heated by 12 Infrared lamps ( 9kW)
  • bottom heating
  • vacuum for external pump system (up to 10exp.-3 hPa, optional RSO-200-HV up to 10exp-6 hPa)
  • SPS controller, SIMATIC
  • 50 programs with 50 steps each storable
  • 7" Touch Panel for comfortable programming and process control   
  • Ethernet interface
  • Max. Temperature: 650 °C
  • Ramp up rate: better 10 K/Sec
    Ramp down rate: T=600°C to 400°C max. 200 K/min
    T=400°C to 100°C max. 30K/min
  • Temperature control by thermocouple
  • Cooling: Water cooling required (option)
  • Electrical connection: CEE 16 A (3x230V, 3 Phase, +N, +PE)
  • Weight: about 55 kg
  • Dimension: 505mm x 504mm x 460mm

Options and accessories:

RSO-200  Basic unit
RSO-GT  Graphite tray with cover
RSO-MFC  Additonal gas line with mass flow controller (max. 4 gas lines)
MP  Membrane pump for vacuum up to 10 mbar with manometer
MPC Chemcial Membrane pump for vacuum up to 10 mbar with manometer
RVP Rotary vane pump for vacuum with oil filter up 10exp3 hPa
RSO-FA Formic Acid Option
RSO-H2 Module for using 100% Hydrogen including one mass flow controller
RSO-H2S Safety device to prevent uncontrolled emission of Hydrogen
RSO-PC-200 add. 200mm oven chamber ("double-chamber oven")
RSO-TC add. thermocouple for measure on device (plugged in chamber)
WC III Closed loop water cooling system (stand-alone)

 

Download
DB_RSO_200_FEB_2017
Acrobat Reader PDF DBRSO-200Feb2017.pdf (1,7 MB)
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