Vacuum Process Oven for up to 300 x 300 mm substrate size and temperature up to 1000 °C
Lamp heated rapid thermal annealing RTA and rapid thermal processing RTP equipment are using lamp heating in order to ramp up and cool down semiconductor wafers pretty fast. This equipment is therefore mainly used for applications where the substrate needs to be brought to a certain temperature just only for short time. The high ramp rates allow a short overall process time and keep the thermal budget (this is the total time of a wafer, being exposed to high temperature) of the wafer low. Because of the design of the heaters, these RTA and RTP tools are used mainly for single wafer treatment. Wafers have to be treated one by one. This is not as important as for other batch thermal processes, which use vertical furnaces and horizontal furnaces, because the process time is very short anyway. However wafer handling takes a substantial part of process time.
The VPO-300 is a cold wall oven.
Processes using also other contaminating processes possible and all other applications of a RTP/RTA oven are oblitgatory,like:
|VPO-MFC||Mass Flow Controller (max. 3 pcs)|
|VPO-RVP||Rotary vane pump for vacuum up to 10exp.-3 with oil filter|
|VPO-SS||Chamber made of stainless steel instead of Alu (polished) 50 mm|
|VPO-GP||Graphite Plate 3 mm thick|
|VPO-QP||Quartz plate for separation of the top lamp area|
|VPO-QH||Quartz universal holder for 100 mm up to 300 mm wafer size (star)|
|VPO-TC||additional thermocouple to measure on device (plugged in chamber); for external measurement tool max. 4 pcs|
|WC-III||Closed loop water cooling system|
|Vacuum||We offer different vacuum pumps and vacuum equipment|
|VPO-SI||Serial interface between VPO sytem and external PC using USB 2.0 port and through USB 2.0 cable|
|VPO-RC||Remote control of top cover and closing, including connection to safety of external cabinet|
||DBVPOFEB2017.pdf (1,7 MB)|