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Pick and Place System (MPS) Epoxy Die Bonder NEW !!!!

NEW IN PROGRAM:
MPS : for small chips and SMD Parts Assembly

Applications:

  • PLATFORM FOR DIE ASSEMBLY AND SMALL SMD PLACEMENT
  • Lab and Prototype (Lab, Jewelry, Watches, smd, BGA,..)
  • Small parts handling capability
  • Solder paste
  • SMD Reflow
  • Eutectic die bonding
  • High precise pick and place of very small and delicate devices
  • The design proveds an easy solution for gluing
  • Video interface compatible for Ultra-HD camera
  • true vertical motion
  • side camera: can be tilted at any angle

High reliable tool. Requires no training.

Features / Parameters:

  • Low picking force: < 10g
  • adjustable bond force
  • Rocking head, dispensing/stamping
  • Power: 100 / 230 VAC  300 Watt
  • Vacuum: integrated in system
  • Dimension: 270x500x352 mm
  • Weight: 17 kg


 

Download
DB_MPS
Acrobat Reader PDF DBMPSNOV2015.pdf (1,5 MB)
  • Pick and Place System (MPS) Epoxy Die Bonder NEW !!!!