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WB200e

Ultrasonic & Reflow Die Bonder

Made in
Germany
easy to
maintain
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• The WB200e, a Die Bonder Equipment designed for accurate placement devices on substrate

• Flip Chip Vision & Thermosonic bonding capabilities

• Thermocompression & Eutectic capabilities

• Reflow capability

• Dispensing for glue or/and paste capability

• High Magnification Optical Device for a high accuracy placement

• Pick and Place of Dies under Vacuum with single collet

• External Vibration Free 

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