Anwendungen und Prozesse:

  • MEMS package sealing with getter activation
  • Rapid Thermal Annealing/Processing
  • Solder Bump Reflow with Plasma pre-cleaning
  • Reflow Soldering, voidfree, fluxless and leadfree
  • Baking and curing of photoresists
  • Sensitive BCB Curing
  • AuGe/SiAu alloying
  • Flip-Chip soldering
  • Package lead sealing
  • Laser/RF/power die attachmentRapid Thermal Processing of Solar Cells by Silicon Wafer Bonding on low cost substratesProcessing of high efficiency silicon solar cells by bonding to borosilicate glass
Hier klicken
und wir rufen Sie an!