WB200-e.jpg

WB200e

Ultrasonic & Reflow Die Bonder - Z automated process

Made in
Germany
wartungs-
freundlich
Download
Video-Clip


The WB200e, a Die Bonder Equipment designed for accurate placement devices on substrate

• Flip Chip Vision & Thermosonic bonding capabilities

• Thermocompression & Eutectic capabilities

• Reflow capability

• Dispensing for glue or/and paste capability

• High Magnification Optical Device for a high accuracy placement

• Pick and Place of Dies under Vacuum with single collet

• External Vibration Free 

Hier klicken
und wir rufen Sie an!