Vacuum Reflow Solder Oven for up to 300 x 300 mm substrate size and temperature up to 450 °C
Perfect for solder processes with substrate size up to 300 mm x 300 mm.
Due to the gas sealed separation of the working capacity (chamber) from the lamp fields this is a perfect tool for contaminating processes. The chamber parts can be easily cleaned.
Through the chamber walls there can be led different feed throughs, like window for optical measurement tools, thermocouple feed through, gas inlets, etc.
The process cycles are very short due to fast reaching of vacuum with 10exp.-3 hPa.
Here are the most feasable applications:
Processes using also other contaminating processes possible and all other applications of a Reflow Solder oven are oblitgatory,like:
Ramp up rate: 2 K/sec.
Ramp down rate: 60 K/min
|VSS-MFC||Mass Flow Controller (max. add. 3 pcs)|
|Membrane Pump or chemical resistant membrane pump for vacuum up to 3 hPa|
|VSS-RVP||Rotary vane pump for vacuum up to 10exp.-3 with oil filter|
|VSS-EH||Extended chamber height up to 120 mm|
|VSS-FA||Formic acid module|
|VSS-SI||Serial interface between VSS system and external PC using USB 2.0 port and through USB 2.0 cable|
|VSS-RC||Remote control of top cover opening and closing, including connection to safety of external cabi´net|
|VSS-TC||additional thermocouple to measure on device (plugged in chamber); for external measurement tool (max. 4 pcs)|
|VAC I||Vacuum basic up to 3 hPa incl. vacuum sensor and valve|
|VAC II||Vacuum comfort up to 10-3 hPa incl. vacuum sensor and valve|
|WC III||Closed loop water cooling system|
||DBVSS-300APR2017.pdf (1,8 MB)|