Vacuum Reflow Solder Oven for up to 300 x 300 mm substrate size and temperature up to 450 °C
Perfect for solder processes with substrate size up to 300 mm x 300 mm.
Due to the gas sealed separation of the working capacity (chamber) from the lamp fields this is a perfect tool for contaminating processes. The chamber parts can be easily cleaned.
Through the chamber walls there can be led different feed throughs, like window for optical measurement tools, thermocouple feed through, gas inlets, etc.
The process cycles are very short due to fast reaching of vacuum with 10exp.-3 hPa.
Here are the most feasible applications and processes:
Ramp up rate: up to 150K/min.
Ramp down rate: up to 120K/min.
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