UniTempVSS-300frontclosed.JPG UniTempVSS-300frontopen.JPG UniTempVSS-300rightopen.JPG

VSS-300

Vacuum Reflow Solder System for up to 300 x 300 mm substrate size

Made in
Germany
easy to
maintain
Download
Video-
Clip

Configuration

Formic Acid Module
gas line
Pressure measurement
Vacuum pump
Cooling system
Cabinet
Formic Acid trap
Flux trap
Hydrogen option
Additional Thermocouple
Moisture measurement
Oxygen measurement
Pat Light
Switchbox
Pressure
Temperature
Chamber height
Interface
Remote control
Power

Product code:

Product price: on request
Delivery time: on request





Vacuum Reflow Solder Oven for up to 300 x 300 mm substrate size and temperature up to 450 °C


Application:

Perfect for solder processes with substrate size up to 300 mm x 300 mm.

Due to the gas sealed separation of the working capacity (chamber) from the lamp fields this is a perfect tool for contaminating processes. The chamber parts can be easily cleaned.

Through the chamber walls there can be led different feed throughs, like window for optical measurement tools, thermocouple feed through, gas inlets, etc.
The process cycles are very short due to fast reaching of vacuum with 10exp.-3 hPa.


Here are the most feasible applications and processes:

  • Solder Reflow with and without flux
  • Wafer bump and solder ball reflow
  • Flip Chip
  • Encapsulation and sealing of housings
  • High Power LED module
  • resistor paste firing
  • IGBT/DBC
  • Die attachment

Chamber:

  • Chamber size: 350 x 350 x 75 mm (optional up to 120 mm)
  • Chamber walls: Aluminium polished, easy to clean (optional: stainless steel)


Loading:

  • Cover: opens and closed vertically  (top loader)
  • Direct or remote control  for automatically application (SPS, robotics,etc).

Ramp up rate:        up to 150K/min.
Ramp down rate:  
up to 120K/min.

 

Heating:

  • Bottom heating: 2 x 12 lamps crossed 18 kW
  • Top heating: on request

 Cooling:

  • Chamber: by a water cooled graphite plate 310 x 310 mm

Process control:

  • Control: SIMATIC SPS with touch panel 7"
  • Software: process control, programming, recording and process
    documentation.
  • 50 programs with 50 steps each storable

Process gases:

  • 1 Mass Flow controller for 5 nlm (norm liter per minute) is standard
  • Optional: up to 4 gas lines

Vacuum (optional):

  • MPC (Chemical resistant Membrane pump): 10  hPa. Monitored by manometer.
  • RVP (Rotary vane pump):  10exp.-3 hPa. Vacuum sensor up to 10exp.-3 mbar

Connections:

  • Power supply: 1 x [CEE 3 x 32 A / 3~ +N+ PE, 230 V>. Back side.
  • Vacuum connector: KF 25
  • Exhaust: KF16 rear site.
  • gas line: 4 mm OD Swagelok compression fitting

Dimension/weight:

  • Dimension: 540 mm x 690 mm x 890 mm (W x D x H)
  • Weight:      about 140 kg 

 

Click here
And we call you back
1 / 3