Technical specification:

• The carrier gas (N2) is lead through a vessel filled with formic acid (FA) and takes small traces of formic acid. This gas mixture is guided through a corrugated metal pipe into process chamber of RSS-110-S reflow solder system.
• Including inlet (6 mm OD) for nitrogen (N2) gas (as carrier gas)
• Including PTFE tube for connection to RSS-110-S system
• Including connection cable for remote control by RSS-110-S reflow solder system
• Dimensions: 290 mm x 150 mm x 104 mm (d x w x h)
• Weight: ca. 4.1 kg

Technical specification:

• The carrier gas (nitrogen gas, N2) enters the vessel which is filled with formic acid (HCOOH) (integrated in housing of reflow solder system). From the liquid surface it will take small traces and lead them to process chamber. There the formic acid causes the reduction of native oxide layers and the improved wetting of solder.

The reflow solder system is upgraded with an additional process gas line including a dedicated mass flow controller (MFC) for nitrogen gas (maximum flow: 5 nlm) as carrier gas for formic acid.  

Technical specification:

• The carrier gas (nitrogen gas, N2) enters the vessel which is filled with formic acid (HCOOH) (integrated in housing of reflow solder system). From the liquid surface it will take small traces and lead them to process chamber. There the formic acid causes the reduction of native oxide layers and the improved wetting of solder.
• The standard process gas line is shared between the direct connection into process chamber and a bypass through the formic acid vessel (i.e. no additional process gas line!).
• The flow of carrier gas (nitrogen gas, N2) is controlled by the mass flow controller (MFC) of standard system.

e.g. forming gas, argon or any other kind of inert gases.

Scope of delivery:

• Absolute type pressure sensor (measurement range: 3...1000 hPa)
• Display and logging of pressure values on touch panel of vacuum system (pos. 1)
• Upgrade of gas outlet with ball check valve
• Upgrade with vacuum valve DN16 (for connection of vacuum pump, vacuum pump not scope of delivery)

Scope of delivery:

• Pirani type sensor (measurement range: 1000 ... 5 x 10-4 hPa)
• Display and logging of pressure values through TP700 touch panel (pos. 1)
• Ball check valve
• Vacuum valve (DN16 or DN25) for connection of vacuum pump (vacuum pump not included)

Technical specification:

• Ultimate pressure: 2 mbar
• Pumping capacity: 4.5 m³/hr (@ 50 Hz)
• Dimensions: 230 mm x 380 mm x 170 mm (W x D x H)
• Weight: 19 kg
• Electrical power supply: 230 V / 1 Phase / 50 Hz / 370 W

Technical specification:

• Welch Vacuum (type MPC 601 T)
• Ultimate pressure: 2 hPa
• Pumping capacity: 4.5 m³/hr (@ 50 Hz)
• Dimensions: 230 mm x 380 mm x 170 mm (W x D x H)
• Weight: 19 kg
• Electrical power supply: 230 V / 1 Phase / 50 Hz / 370 W
• Remotely controlled (switched ON/OFF) by vacuum reflow solder system (pos. 1)

Technical specifications:

• Pumping capacity: 2.5 m³/hr
• Ultimate pressure: 3 x 10-3 hPa
• With oil filter
• Electrical power supply: 115V or 230 V / 50 Hz / 1 Phase / 150 W
• Dimensions: 130 mm x 310 mm x 180 mm (W x D x H)
• Weight: 10.5 kg

Technical specifications:

• Refrigeration capacity: 2.1 kW
• Tank capacity: 13 l
• Electrical connection type: Shockproof plug 1 x 230V, 1 ~,  N, PE, 1.3 kW
• Dimensions: 500 mm x 700 mm x 510mm (W x D x H)
• Weight: 52 kg

Technical specification:

• Refrigeration capacity: 2.6 kW
• Tank capacity: 13 l
• Electrical connection type: Shockproof plug 1 x 230V, 1 ~,  N, PE, 2.0 kW
• Dimensions: 500 mm x 740 mm x 510 mm (W x D x H)
• Weight: 55 kg

Technical specification:

• Refrigeration capacity: 3.9 kW
• Tank capacity: 13 l
• Electrical connection type: shockproof plug: 1 x 230 V, 1 ~,  N, PE, 2.4 kW
• Dimensions: 500 mm x 740 mm x 510 mm (W x D x H)
• Weight: 62 kg

Technical specification:

• Refrigeration capacity: 8.8 kW
• Tank volume: 60 l
• Dimensions: 760 mm x 760 mm x 1335 mm (W x D x H)
• Weight: 160 kg
• Electrical power supply: 400 V / 50 Hz / 3P + PE / 2.7 kW

Technical specification:

• Pump: 230 V / 50 Hz / 1300 W
• Water tank capacity: 30 liters
• Cooling capacity: 10 kW
• Dimension: 504 x 714 x 412 mm (L x W x H)
• Weight: 48 kg (empty tank)
• Water inlet pressure: 5 bar (0.5 MPa)

Water inlet temperature: 16 ... 20 °C

Temperature extension from 400°C up to 500°C

Technical description:
This trap is integrated between vacuum valve and vacuum pump. Using an adsorption filter formic acid vapor is bound and can not reach the vacuum pump.

Including two adapters DN16KF to DN25KF to accomodate for difference between trap flange (DN25KF) and vacuum flange (DN16KF) size.

Including filter element with active charcoal filter

Technical specification:

• Hydrogen control unit integrated into RTP/RSO system (pos. 1)
• Control of flow of pure (100%) hydrogen (H2) gas via Mass Flow Controller (MFC)
• Automatic check of leak tightness of process chamber
• Permanent control of H2 gas flow using N2 pressurized valves
• Interlock with program start

Hydrogen flame-off unit at rear side of RTP/RSO system (above gas outlet) for preventing formation of explosive oxyhydrogen gas

Technical specification:

• Transparent laboratory hood with nozzle for gas outlet (to ventilation)
• Including hydrogen sensor (triggers alarm function when hydrogen gas is escaping)
• System independent
• Dimension: 990 mm x 690 mm x 1480 mm (W x D x H)

Weight: about 105 kg

Technical specification:

• Upgrade of process chamber with TC connector (female) and with TC line to rear side of reflow solder oven (female TC connector)
• Additional TC , Type K, dia. 0,5mm, L=500mm
• Ideal to measure on device

temperature measurement of additional thermocouple requires an external measurement tool

Technical specification:

• Upgrade of process chamber with TC connector (female) and with TC line connected to process controller
• Additional TC, Type K, dia. 0,5mm, L=500mm
• Ideal to measure on device

Monitoring and logging of temperature of additional thermocouple by process control

to measure moisture residues in the chamber

Technical specification:

• Measurement range of oxygen (O2) concentration: 0...1000 ppm (= 0.1 Vol-%)
• Operational pressure: atmosphere
• values of oxygen concentration in process chamber can be displayed on touch panel of base system and can be logged into process data (when option is checked in menu "datalogger")

Technical description:

• Chassis of  reflow vacuum solder system (pos. 1) will be upgraded with handle lock pin
• After activation of interlock option (by setting a check box in menu of process control) any unintentional opening of hinged cover and hence of process chamber during running process can be prevented.
• With activated interlock option the handle lock will be released after program stop and at temperature T < 80 °C (depending on setting of value)

Technical specification:

• Signal tower located at rear side of process system
• Indication of system status by visual and acoustical signals
• Color status: Red (Error), Yellow (Idle), Green (Program running)

to watch the reflow soldering process

Technical specification:

• USB 3.0 camera with resolution 2560 x 1920 pixels
• USB 3.0 cable (1.5m length)
• Macro Lens (Edmund, TECHSPEC UC-Series, 12 mm, 1/2")
• Mount for USB 3.0 camera and macro lens
• Including manual z-drive
• LED ring light, adjustable

on request

(double pack oven) 100mm 

(double pack oven) 150mm

Technical specification:

• For remote control of vacuum pump electrically supplied with single phase (230 V AC)
• Integrated at bottom rear side of RTP-100 system (pos. 1)
• Blue powerCON socket for power supply cable (from power socket)
• Grey powerCON socket for power supply cable (to vacuum pump)
• Including two cables (each 2 meters long): Power supply cable terminated with local plug (see below bullet) and blue powerCON connector; Vacuum pump cable terminated with grey powerCON connector and C13 rubber connector
• Local plug: Denmark (DS 60884-2-D1)
• Dimension: 145 mm x 140 mm x 55 mm; Weight: 0.5 kg

Free of charge in case that vacuum pump is purchased through UniTemp GmbH

230V/ 1phase

400V/ 3 phases

100V/ 1 phase

200V/ 2 phases

200V/3 phases

115V/ 1 phase

208V/ 2 phases

208V/ 3phases

Modification of the oven for overpressure (0.3 MPa absolute pressure, 2 bar = 28 psi relative to STP) in process chamber
Pressure sensor suited for both vacuum (1000 ... 2 mbar absolute) and overpressure (0 ... 2 bar relative)

Temperature extension up to 1200 °C (the holding time depends on the efficiency of the water cooling system)

High Vacuum for vacuum up to 10exp-6 hPa
including:
* digital vacuum gate valve
* HiPace 300 Vacuum pump
* Vacuum valve 
* edge valve

Serial interface between oven system and external PC

Technical description:
Using USB 2.0 port and with communication through USB 2.0 cable
An advanced communication protocol allows remote operation of the oven system from an external PC: selection of program number, start/stop of program, (opt. moving up/down of lift pins) with relevant feedback and error signals
For opening/closing of top cover of oven system option RC (remote control) is required as this operation is related to work safety.

Remote control of the oven

Technical description:
This option includes opening/closing of top cover of the oven using potential free signals.
It also includes connection of the system to safety cover of external cabinet (opening of safety cover will disengage remote control i.e. only manual control buttons at front panel of oven system will be active in this case)

Technical specification:

• The carrier gas (nitrogen gas, N2) enters the vessel which is filled with formic acid (HCOOH) (integrated in housing of reflow solder system). From the liquid surface it will take small traces and lead them to process chamber. There the formic acid causes the reduction of native oxide layers and the improved wetting of solder.

The reflow solder system is upgraded with an additional process gas line including a dedicated mass flow controller (MFC) for nitrogen gas (maximum flow: 5 nlm) as carrier gas for formic acid.  A motorized and sensor based system allows the refilling of the acid. 

Additional gas line with Mass Flow Controller for e.g.  argon, forming gas or nitrogen. Other gases on request.

Two additional gas lines with Mass Flow Controller for e.g.  argon, forming gas or nitrogen. Other gases on request.

Three additional gas line with Mass Flow Controller for e.g.  argon, forming gas or nitrogen. Other gases on request.

Four additional gas line with Mass Flow Controller for e.g.  argon, forming gas or nitrogen. Other gases on request.