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RSS 3X210-S

Vacuum Reflow System with SIMATIC control for substrate size up to 3 x (200 x 200 mm) Lift pins for wafer lift up and down

Made in
Germany
easy to
maintain
Download

Configuration

Formic Acid
Gas line
Vacuum
Pump
Water Cooling System
Temperature
Chamber
Trap
Hydrogen option
Thermocouple
Measurement
Safety
Pat Light
Side window
USB Camera
Switchbox
Viewport
Power

Product code: RSS 3X210

Product price: on request
Delivery time: on request




Reflow Solder System for serial production

The RSS-3X210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas.

The reflow solder system is perfect for the following applications:

  • flux-less soldering
  • flip chip process
  • adhesive bonding
  • solder bump reflowing
  • soldering of power devices
  • heat treatment of semiconductor wafers
  • prototype development
  • quality control

Technical Data:

  • heated area: 3 heated plates with each 210 mm x 210 mm
  • chamber height: 40 mm (optional up to 80 mm)
  • Mass Flow controller for Nitrogen (5 nlm)
  • vacuum atmosphere up to 10exp.-3 hPa (KF16 connector)
  • temperature up to 300 °C (higher on request)
  • ramp up rate:      better 120 K/minute
  • ramp down rate:  better 60 K/minute
  • SIMATIC© process control with 50 programs and 50 steps each
  • 7" touch panel
  • water cooled chamber (controlled and watched)
  • electrical connection type: 3x 230V,3P, +N, 18 kW

Options and accessories

FA I Formic acid module (separate module, not integrated) with Mass Flow Controller
FA II integrated formic acid module with Mass Flow Controller
FA III integrated formic acid module with shared Mass Flow Controller
MFC additional Mass Flow Controller (max. 2 pcs)
RSS-EH Chamber height 80mm instead of 40mm
RSS-H2 Hydrogen Module: for using 100% Hydrogen incl. gas line with Mass Flow Controller
RSS-H2S Safety device to prevent uncontrolled emission of Hydrogen
RSS-IL Interlock mechanism during operation
Lift Pins Lift pin option for Wafer up and down movement
RSS-TC Additional thermocouple (max. 3 pc)
VAC I Basic Vacuum up to 3 hPa, incl. vacuum sensor and valve, excl. pump
VAC II Comfort Vacuum up to 10E-3 hPa, incl, vacuum sensor and valve, excl. pump
MP Membrane/Diapgraghm pump for vacuum up to 3 hPa
MPC Chemical resistant membrane pump for vakuum up to 3 hPa
RVP Rotary vane pump for vacuum up to 10E-3 hPa with oilfilter
WC II Closed loop water cooling system

 

 

 

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