Vacuum Reflow Solder Oven for up to 300 x 300 mm substrate size and temperature up to 450 °C and high vacuum up to 10E-6 hPa
Application:
Perfect for solder processes with substrate size up to 300 mm x 300 mm.
Due to the gas sealed separation of the working capacity (chamber) from the lamp fields this is a perfect tool for contaminating processes. The chamber parts can be easily cleaned.
Through the chamber walls there can be led different feed throughs, like window for optical measurement tools, thermocouple feed through, gas inlets, etc.
The process cycles are very short due to fast reaching of vacuum with 10exp.-3 hPa.
Here are the most feasable applications:
Processes using also other contaminating processes possible and all other applications of a Reflow Solder oven are oblitgatory,like:
Chamber:
Loading:
Ramp up rate: up to 150K/min.
Ramp down rate: up to 120K/min.
Heating:
Cooling:
Process control:
Process gases:
Vacuum
with turbomolucularpump, vacuum valve and measurement for vacuum up to 10E-6 hPa
optional fore pump:
Connections:
Dimension/weight:
Personal Contact |
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+49(0)8441-78 76 63 |
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sales@unitemp.de |