• The WB200e, a Die Bonder Equipment designed for accurate placement devices on substrate
• Flip Chip Vision & Thermosonic bonding capabilities
• Thermocompression & Eutectic capabilities
• Reflow capability
• Dispensing for glue or/and paste capability
• High Magnification Optical Device for a high accuracy placement
• Pick and Place of Dies under Vacuum with single collet
• External Vibration Free
Personal Contact |
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+49(0)8441-78 76 63 |
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sales@unitemp.de |