RSS-160-SC (Compact)

Mini Vacuum Reflow System with SIMATIC control for substrate size up 160 mm x 160 mm

Made in
easy to


Formic Acid
Gas line
Pat Light

Product code: RSS-160-SC

Product price: on request
Delivery time: on request

Mini Vacuum Reflow Solder System

The RSS-160-SC Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas.
The heating plate is heated by heating cartridges and has a heated area with 160x160mm. It is made of aluminium. The excellent cooling rates are based on a water cooled chamber.Requires water cooling.

The reflow solder system is perfect for the following applications:

  • flux-less soldering
  • flip chip process
  • adhesive bonding
  • solder bump reflowing
  • encapsulation of housings
  • soldering of power devices
  • heat treatment of semiconductor wafers
  • prototype development
  • quality control

Specification RSS-160-SC (including options and accessories)

Max. substrate size 160 mm x 160 mm x 65 mm
Max. temperature up to 400 °C
T° continious  400 °C
Ramp up rate 120 K/Min.
Ramp down rate up to 90 K/Min. 
Substrate cooling water cooled
Chamber cooling water cooled channels
Vacuum  up to 10exp.-3 hPa, integrated pressure sensor
Flow meter Mass Flow Controller for Nitrogen and other inert gases
Gases Inert gases, other on request
Controller SIMATIC© with 7" Touch Panel
Heating plate Aluminium
Chamber height inside 70 mm
Programs 50 programs saveable 
Formic acid module 40ml vessel, to be filled manually
Dimension 365 x 520 x 275 mm
Weight 25 kg
Power  1 Phase, 230V, 50/60Hz or 100-115V or 200-208V
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