UniTemp - your partner for all kind of thermal processes

We develop and sell equipment for microelectronics. Our main focus is based on thermic process engineering. UniTemp combines the technical, ergonomical and economical function with perfect harmony in technics and design to achieve best quality.

All UniTemp products are developed and manufactured in-house.
We are very flexible in adapting our standard equipment according to special requirements.

   We exhibit at the following shows:
  • Mar 2018: SEMICON China 2018

    14.-16. March 2018 German Pavillon (Hall N2 Booth 2674) Alltek Booth (will follow)
  • Mar 2018: Japan Society of Applied Physics Nagoya

    17.-20. March 2018
  • May 2018: Joining Osaka

  • More...

Reflow Soldering

We offer different kind of table top and space saving systems (for R&D use, for prototyping and small series production)

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We are specialized in developing of rapid thermal annealing systems, mainly for R&D use.

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Hot plates & Chucks

Programmable Hot Plates with integrated precision Controller, Reflow of any soldering alloy

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Wire Bonder, Die Bonder & Others

Pick & PlaceFlip chip assemblyvery small and large components, IC, capa-chips, resistor chip, etc.

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