UniTemp - your partner for all kind of thermal processes

We develop and sell equipment for microelectronics. Our main focus is based on thermic process engineering. UniTemp combines the technical, ergonomical and economical function with perfect harmony in technics and design to achieve best quality.

All UniTemp products are developed and manufactured in-house (including software). In 2017 we established a mechanical manufacturing area with a 5-axis-CNC machine and a water cutting system. Therefore we are very flexible in adapting our standard equipment according to special requirements.

   We exhibit at the following shows:
  • Apr 2019: Aerospace Technology & Component Expols Expo (Aero Tech) JAPAN

    17 -19 April 2019 at Portmesse NAGOYA
  • May 2019: PCIM Nuremberg

    7-9 May 2019 Hall 6-208
  • May 2019: Adhesion & Joining EXPO Osaka

    22-24 May 2019 at Intex OSAKA

  • More...

Reflow Soldering

We offer different kind of table top and space saving systems (for R&D use, for prototyping and small series production)

Read more »


We are specialized in developing of rapid thermal annealing systems, mainly for R&D use.

Read more »

Hot plates & Chucks

Programmable Hot Plates with integrated precision Controller, Reflow of any soldering alloy

Read more »

Wire Bonder, Die Bonder & Others

Pick & PlaceFlip chip assemblyvery small and large components, IC, capa-chips, resistor chip, etc.

Read more »