UniTemp - your partner for all kind of thermal processes

We develop and sell equipment for microelectronics. Our main focus is based on thermic process engineering. UniTemp combines the technical, ergonomical and economical function with perfect harmony in technics and design to achieve best quality.

All UniTemp products are developed and manufactured in-house (including software, based on SIMATIC© controller . In 2017 we established a mechanical manufacturing area with a 5-axis-CNC machine and a water cutting system. In 2019 we added a coating machine for surface treatment.  Therefore we are very flexible in adapting our standard equipment according to special requirements.

   We exhibit at the following shows:
  • Jun 2020: SEMICON CHINA

    27-29 Jun 2020: SEMICON SHANGHAI German Pavillion, Booth 2673
  • Nov 2020: The Japan Society for Aeronautical and Space Sciences

    ASTY-TOKUSHIMA, Japan November 6 (Wed) to November 8 (Fri) 2019
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And we call you back

Reflow Soldering

We offer different kind of table top and space saving systems (for R&D use, for prototyping and small series production)

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We are specialized in developing of rapid thermal annealing systems, mainly for R&D use.

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Hot plates & Chucks

Programmable Hot Plates with integrated precision Controller, Reflow of any soldering alloy

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Wire Bonder, Die Bonder & Others

Pick & PlaceFlip chip assemblyvery small and large components, IC, capa-chips, resistor chip, etc.

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