UniTemp - your partner for all kind of thermal processes

We develop and sell equipment for microelectronics. Our main focus is based on thermic process engineering. UniTemp combines the technical, ergonomical and economical function with perfect harmony in technics and design to achieve best quality.

All UniTemp products are developed and manufactured in-house.
We are very flexible in adapting our standard equipment according to special requirements.
 

   We exhibit at the following shows:
  • Oct 2017: IMAPS Munich

    19-20 October 2017, Munich
  • Nov 2017: PRODUCTRONICA Munich

    14-17 Nov 2017 Hall B2/Booth 356
  • December 2017: SEMICON JAPAN

    13-15 Dec 2017 Tokyo BIG SIGHT Booth: 1709-5
  • Jan 2018: SPIE USA

    30.Jan - 01.Feb 2018 SPIE.Photonics West San Francisco Booth 4629-07
  • June 2018: SMT Nuremberg

    05.-07.06.2018, Hall 4 Booth 130

Reflow Soldering

We offer different kind of table top and space saving systems (for R&D use, for prototyping and small series production)

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RTP/RTA Ovens

We are specialized in developing of rapid thermal annealing systems, mainly for R&D use.

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Hot plates & Chucks

Programmable Hot Plates with integrated precision Controller, Reflow of any soldering alloy

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Wire Bonder, Die Bonder & Others

Pick & PlaceFlip chip assemblyvery small and large components, IC, capa-chips, resistor chip, etc.

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