UniTemp - your partner for all kind of thermal processes

We develop and sell equipment for microelectronics. Our main focus is based on thermic process engineering. UniTemp combines the technical, ergonomical and economical function with perfect harmony in technics and design to achieve best quality.

All UniTemp products are developed and manufactured in-house.
We are very flexible in adapting our standard equipment according to special requirements.

   We exhibit at the following shows:
  • May 2017: SMT Nuremberg

    16-18 May 2017, Hall 4, Booth 130
  • June 2017: JISSO PROTEC (JPCA) Japan 2017

  • Oct 2017: IMAPS Munich

    19-20 October 2017, Munich
  • Nov 2017: PRODUCTRONICA Munich

    14-17 Nov 2017

Reflow Soldering

We offer different kind of table top and space saving systems (for R&D use, for prototyping and small series production)

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We are specialized in developing of rapid thermal annealing systems, mainly for R&D use.

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Hot plates & Chucks

Programmable Hot Plates with integrated precision Controller, Reflow of any soldering alloy

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Wire Bonder, Die Bonder & Others

Pick & PlaceFlip chip assemblyvery small and large components, IC, capa-chips, resistor chip, etc.

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