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HP-155

Compact hot plate with integrated precision controller Reflow of any soldering alloy Pre-heating for wire bonding Expoy curing Laboratory tests

Technical Data:

Heated Area: 155x155 mm
Temperature Range: up to 350 °C
Power supply:

230V, 1000 Watts
or
115V, 1000 Watts

Dimension HP-155: 32 mm x 21 mm x 55 mm
Weight> 3,5kg

 

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Hot Plates
Acrobat Reader PDF hotplates0511.pdf (278 KB)