DE_d3385d785d3c_HP60freiweb.jpg

HP-60

Applications examples:

  • Reflow Soldering of flat components
  • Preheating of heavy parts for soldering,
  • annealing.
  • curing of photoresists and epoxies


Optional:
Waffle pack holder Slotted Top Plate for DIL housing for HP-90Top plate for T03 housingTop plate for T05/T08 housing

Technical Data:

Heated Area: 60 mm diameter
Temperature Range: up to 250 °C
Power supply: 40V, 80Watts
Dimension: dia. 80mm total
Height adjustable: 66-78mm
Weight 0,6kg
External Temperature Controller: HC-40

 

Download
Hot Chucks
Acrobat Reader PDF hotchucks0511.pdf (1,7 MB)