HPP-155-L-Hfreigestelltweb.jpg

HPP-155-L

Programmable Hot Plate with lift pins with vacuum hold for 3" up to 6" wafer size wafer size or 150 x 150 mm substrate size

  • Applications examples:
  • Reflow Soldering of flat components
  • Preheating of heavy parts for soldering
  • Annealing
  • Curing of photoresists and epoxies

Technical Data:

Heated area: 155 x 155 mm
Lift pins: 3 lift pins programmable
Temperature range: Room temperature up to 350 °C
Part fixture: by vacuum for external vacuum pump
Programming: USB (optional) with Eurotherm 2416 controller
Power supply: 230 V, 1000 W or 115 V, 1000 W
Weight: 4 kg

 

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Hot Plates
Acrobat Reader PDF hotplates0511.pdf (278 KB)