Plasma Cleaning & Heat: PTP-300

Universal temperature and plasma cleaning machine with maximum part loading area: 305 mm x 305 mm (25 mm max. part height)


  • Activation, cleaning and coating of surfaces
  • fast ramp up heating of substrates and wafers
  • fluxless soldering
  • flip chip processing
  • adhesive bonding
  • Solder bump reflow
  • Soldering of power devices
  • small series production and prototype development

Technical Data PTP-300:

Loading area: 305 mm x 305 mm x 25 mm (process area)
Chamber height: 35 mm
Chamber material: Aluminium / quartz glass
Chamber material (optional): Aluminium or quartz glass process chamber (size: 305 x 305 x 26 mm)
Dimension outside: 600 mm x 1850 x 880 mm (WxDxH)
Chamber: integrated gas inlet / 2 gas lines are default
Gas lines: 2 Mass Flow Controllers
Vacuum: DN25 KF vacuum flange
Heating: 24 infrared lamps (total 18 kW)
Process control by: SPS Controller PP420 (B&R) with LCD display
Maintenance: Ethernet
Microwave generator: for plasma cleaning or removal of oxyde resists 2,45 GHz, max. 600 W, stepless from 100 W to 600 W
Cooling: water cooling required (water cooler optional)
Power: 3/N/PE; AC; 50/60 Hz; 230/400 V
Weight: 150-200 kg (depends on acessories)

Options and accessories:

PTP-AL Automatic Loading
PTP-MFC Mass Flow Controller
PTP-RPP Double stage rotary vane pump for vacuum up to 10-3 mbar
PTP-HVP Turbomolecular pump with gate valve and Pirani gauge for vacuum up to 10-6 mbar
PTP-WC Closed loop water cooling system


General Information about Plasma technology
Acrobat Reader PDF plasmageneral.pdf (681 KB)
Acrobat Reader PDF PTPMay2011.pdf (215 KB)
Typical Plasma applications
Acrobat Reader PDF plasmatypical.pdf (44 KB)