EN_812a087b75b3_RTP-200UHEopengraphit.jpg EN_f7512a010471_UNIRTP-200Schublade100erWafer.jpg EN_a05753a11cc5_UNIRTP-200Schublade150erWafer.jpg EN_031d0af4ae36_UNIRTP-200Schublade200erWafer.jpg EN_389ec49141b4_UNIRTP-200Schublade200erTiegel.jpg

NEW: RTP-200

Rapid Thermal Annealing Oven

Made in
Germany
easy to
maintain
Video-
Clip

Configuration

Gas line
Vacuum
Pump
Water Cooling System
Hydrogen option
Thermocouple
Measurement
Safety
Pat Light
Switchbox
Ramp rate
Fixture of cabinet
Hood
Quartz Glass
Graphit
Power

Product code: RTP-200

Product price: on request
Delivery time: on request




RTP-200 / RTP-200-HV
Rapid Thermal Process Vacuum oven with or without high vacuum 

Technical Specification
• For one single wafer up to 200mm (8") diameter
• With integrated gas in- and outlet
• Maximum temperature: 1000 °C
• Ramp up rate: up to 50 K/sec (optional: 100 K/sec)
• Temperature control by thermocouple (K or S)
• No quartz chamber, aluminium chamber
• Dimensions: about 578 mm x 496 mm x 570 mm (W x D x H)
• Weight: about 70 kg


Part holder
• Quartz tray, fix integrated in door
• Quartz holder for single wafer with 200 mm diameter and graphite susceptor

Heating

• Heated by 2 x 12 infrared lamps (nominal voltage/power of IR heater: 230 V/2 kW)
• Top and bottom heating (selectable)

Vacuum
•  pressure scale 10exp-3 hPa ... 1000 hPa, or 10exp-6 hPa für RTP-200-HV 

Process Control
• SPS process controller with 50 programs and up to 50 steps each 
  (ethernet interface), SIMATIC
• 50 programs each with up to 50 steps can be stored on touch panel
• USB 2.0 interface for storage of process data (in CSV file format)
• Including 7" touch panel for intuitive and comfortable operation

Water cooling
• Water cooling required (inlet pressure: 5 bar, water inlet temperature: 16...20 °C, low water hardness (< 5° dH), 
   free of Cu particles)