High vacuum compliant Rapid Thermal Process Oven with ramp-up rate up to 150 K/sec.
Key features are
Multipurpose table top unit with front loading drawer for the following applications:
Technical Data:
The oven will be programmed by a Siemens SPS controller. This allows the storage of 50 programs with saving all temperature profiles and segments. Options and accessories like water cooler, additional flow meters, additional gas lines, additional thermocouple etc. are available on request. This tool is for various applications and customers. The small size allows comfortable loading and unloading of the chamber. The oven can be easily placed on a standard laboratory table.
Options and accessories:
RTP-100-HV | Basic unit with 1 MFC for Nitrogen (5 nlm) |
RTP-MFC | Mass Flow controller (max. 4 in total) |
MP | Membrane or diapgrahm pump |
RVP | Rotary vane pump |
RTP-Ox | Oxygen level measurement |
RTP-MM | Moisture level measurement |
RTP-H2+H2S | Hydrogen Module to use 100% Hydrogen with safety device incl. MFC |
RTP-SW | Switchbox for chiller and/or vacuum pump |
RTP-TC | Add. Thermocouple to measure on device (max. 1 pc) |
RTP-VCR | VCR connectors and lines (on request) |
WC III | Closed loop water cooling station |
RTP-GP | Graphite Plate or suzceptor (SiC coated: on request) |
RTP-100-PC | additional oven chamber for usage with one process controller unit (double pack oven) 100 mm |
RTP-QR-50 | Adapter for 50 mm wafer size |
RTP-QR-75 | Adapter for 75 mm wafer size |
Personal Contact |
|
+49(0)8441-78 76 63 | |
sales@unitemp.de |
External Formic Acid Modul (including Mass Flow Controller) (able also for later retrofit)
Technical specification:
Weight: ca. 4.1 kg
Integrated Formic Acid Module with separate MFC for carrier gas (N2)
Technical specification:
Process chamber will be upgraded by an interlock pin which prevents unintended opening of hinged cover during running process.
Formic Acid Module integrated but sharing the existing N2 gas line
Technical specification:
Process chamber will be upgraded by an interlock pin which prevents unintended opening of hinged cover during running process.
Additional gas line with Mass Flow Controller, e.g. forming gas, argon or any other kind of inert gases.
VAC I Vacuum Basic for e.g. membrane/diaphragm pump for vacuum up to 3 hPa
Scope of delivery:
Upgrade with vacuum valve DN16 (for connection of vacuum pump, vacuum pump not scope of delivery)
Vacuum Comfort Option for vacuum up to 10-3 hPa (e.g. for rotary vane pumps)
Scope of delivery:
Vacuum valve (DN16 or DN25) for connection of vacuum pump (vacuum pump not included)
Membrane pump
Technical specification:
Electrical power supply: 230 V / 1 Phase / 50 Hz / 370 W
Chemically resistant membrane pump / diaphraghm pump (strictly recommended for using formic acid)
Technical specification:
Remotely controlled (switched ON/OFF) by vacuum reflow solder system (pos. 1)
Rotary vane pump (Pfeiffer Vacuum DUO 3)
Technical specifications:
Weight: 10.5 kg
Closed loop water cooling system (stand alone)
Technical specifications:
HTS code: 8419 8910
Closed loop water cooling system (stand alone)
Technical specification:
HTS code: 8419 8910
Closed loop water cooling system
Technical specification:
HTS code: 8419 8910
Closed loop water cooling system
Technical specification:
Electrical power supply: 400 V / 50 Hz / 3P + PE / 2.7 kW
Extension of maximum temperature from 400 °C up to 500 °C
Extension of chamber height from 60 mm to 80 mm
Trap for formic acid vapor (for pump protection)
Technical description:
This trap is integrated between vacuum valve and vacuum pump. Using an adsorption filter formic acid vapor is bound and can not reach the vacuum pump.
Including two adapters DN16KF to DN25KF to accomodate for difference between trap flange (DN25KF) and vacuum flange (DN16KF) size.
Trap for flux vapor (for protection of vacuum pump)
Technical description:
Replacement of filter element is recommended after two to three months of usage or when pumping power significantly decreases. Spare filter elements are available at article number 19370.
Option: Usage of 100% hydrogen gas
Technical specification:
Hydrogen control unit integrated into RTP/RSO system (pos. 1)
Control of flow of pure (100%) hydrogen (H2) gas via Mass Flow Controller (MFC)
Automatic check of leak tightness of process chamber
Permanent control of H2 gas flow using N2 pressurized valves
Interlock with program start
Hydrogen flame-off unit at rear side of RTP/RSO system (above gas outlet) for preventing formation of explosive oxyhydrogen gas
Technical specification:
Weight: about 90 kg
Additional thermocouple for external measurement device
Technical specification:
Temperature measurement of additional thermocouple requires an external measurement tool (e.g. multimeter with measurement input for thermocouple).
Additional thermocouple with monitoring/logging function (not RSS-210-S)
Technical specification:
The temperature of additional TC can be displayed and logged by touch panel of vacuum process or reflow solder system.
Technical specification:
Values of moisture concentration in process chamber can be displayed on touch panel of base system and can be logged into process data (when option is checked in menu "datalogger")
Interlock mechanism
Technical description:
Free of charge (100% discount) in case that option FA III will be purchased with this reflow solder system.
Adding of color signal tower to VSS-450-300 system (pos. )
Technical specification:
Indication of system status by visual and acoustical signals
Side viewing windows (20mm high, 170 mm width) at both sides of hinged cover of RSS-210-S reflow solder system
This option includes a CCD camera with a macro lens suitable for observing the soldering process, which is mounted on the hinged cover of the reflow solder system (RSS, RVS) by means of a suitable bracket. The solder process can be illuminated via a flexible LED light.
Technical specification:
A Windows PC with USB 3.0 interface port is provided by customer.
Power RSS-110-S EU
230V, P+N+PE, 1,6 kW
Power RSS-210-S EU
3 x 400 V, 50 Hz, 3~ + N + PE, 9.0 kW
Power RSS-110 JAPAN
200 V, 2~ + PE, 1,2 kW
Power RSS-210-S Japan
3x200V, 3~ +PE, 9.0 kW
Power supply RSS-110-S USA
115V AC, 60 Hz, P+PE, 1.2 kW
3 x 208V, 3~ +PE, D (triangle) configuration, 7.4kW, 21 A
Technical specification:
Nominal voltage/wattage of one IR heater: 230 V/1500 W
Reduction of maximum heating rate (see pos. 1) due to reduced power
Extension of maximum temperature of VPO-1000-300 system (pos. 1) up to 1200 °C
Technical specification:
Reduction of maximum ramp up rate
Extension of chamber height from 50 mm to 100mm , including viewing window (85 mm wide, 25 mm high)
Extension of maximum ramp up rate from 150 K/sec to 200 K/sec
Technical specification:
Installation requirements: 2 x [3 x 400 V, 3~ + N + PE, star (Y) configuration, 32 A, 21 kW>
Extension of maximum temperature from 450 °C up to 600 °C
Technical specification:
Cooling down of heating plate: from 600 °C to 450 °C using CDA; from 450 °C to room temperature using cooling water
Serial interface between VPO system and external PC
Technical description:
For opening/closing of top cover of VPO system option VPO-RC (remote control) is required as this operation is related to work safety.
Remote control of VPO system
Technical description:
It also includes connection of VPO system to safety cover of external cabinet (opening of safety cover will disengage remote control i.e. only manual control buttons at front panel of VPO system will be active in this case)
Additional gas line with Mass Flow Controller for e.g. argon, forming gas or nitrogen. Other gases on request.
Three additional gas line with Mass Flow Controller for e.g. argon, forming gas or nitrogen. Other gases on request.
Circulating Fluid Temperature Controller - water cooled
Technical specification:
Circulating fluid system:
Facility water system:
Electrical system:
Weight (dry): about 124 kg
Safety measures for use of forming gas and oxygen gas
Technical description:
Mutual lock of process gas lines preventing simultaneous use of both forming gas and oxygen gas
Automatically performed leakage measurement from process chamber until inlet valve
(integrated chamber leakage test)
Switch box for vacuum pump
Technical specification:
Free of charge in case that vacuum pump is purchased through UniTemp GmbH
Switch box for chiller
Technical specification:
Free of charge in case that recirculating water chiller is purchased through UniTemp GmbH
Service Cart with rolls
Weight: 40 kg
Dimension: 600x780x915mm
Cabinet with integrated Universal Heat Exchanger
Width: 600 mm ; Depth: 780 mm
Total height: 915 mm
Technical specification of heat exchanger:
Water inlet temperature: 16 ... 20 °C
Cabinet with integrated Universal Heat Exchanger
Width: 600 mm ; Depth: 780 mm
Total height: 915 mm
Technical specification of heat exchanger:
Water inlet temperature: 16 ... 20 °C
Cabinet with integrated Universal Heat Exchanger
Width: 600 mm ; Depth: 780 mm
Total height: 915 mm
Technical specification of heat exchanger:
Water inlet temperature: 16 ... 20 °C
Cabinet with integrated Universal Heat Exchanger
Width: 600 mm ; Depth: 780 mm
Total height: 915 mm
Technical specification of heat exchanger:
Water inlet temperature: 16 ... 20 °C
Universal Heat Exchanger
Technical specification:
Water inlet temperature: 16 ... 20 °C
Seismic fixture of cabinet
Technical description:
This option includes upgrade of service cart with three mounting brackets and provision of seismic jigs for seismic fixture of mounting brackets to floor.
Stromversorgung RTP-100
3 x 400 V, 3~ + N + PE, 50-60 Hz, Y, 32 A, 20 kW
Power Japan RTP-100
3 x 200 V, 3~ + PE, 50-60 Hz, 20 kW, 58 A
Power RTP-100 USA (230V nom.volt.)
3 x 208 V, 3~ + PE, 50-60 Hz, 16 kW, 45 A, Triangle () configuration
Nominal voltage/wattage of IR heater: 230 V/1100 W
3 x 400 V, 3~ + N + PE (Y configuration), 21 kW, 32 A
Notes:
1) 400 V: voltage between two phases (voltage between one phase and neutral wire: 230 V)
2) Nominal IR lamp voltage/wattage: 230 V/1000 W
Power RTP-150 Japan
3 x 200V, 3~ + PE, 24 kW, max. 70 A
Strom RTP-150 USA
3x208V,3~+PE, 20 kW
Power RTP-200 EU
3 x 400 V, 3~ + N + PE (Y configuration), 21 kW, 32 A
Notes:
1) 400 V: voltage between two phases (voltage between one phase and neutral wire: 230 V)
2) Nominal IR lamp voltage: 230 V
Power RTP-200 Japan
3x200V,3~+PE, 24 kW
Power RTP-200 US
3 x 208 V, 3~ + PE, D configuration, 23.5 kW, 65 A
Technical comments:
1) Nominal voltage/wattage of IR heater: 210 V/1000 W
2) Voltage between phases: 208 V
3) Voltage during Factory Acceptance Test: 200 V
Power Supply VSS Europa
32A CEE, 3 x 400 V, 3 Phases + N + PE, Star configuration (Y), 18 kW
Notes:
1) The VSS system is provided with a power supply cable terminated with 32A connector according to IEC 60309 (3L+N+PE, 6h).
2) 400 V is the voltage between two phases (230 V is voltage between one phase and neutral wire)
3) Nominal voltage of IR heater: 230 V
Power VSS-450-300 Japan
3 x 200 V, 3~ + PE, Delta () configuration, 50...60 Hz, 18 kW, 52 A
Power VSS USA
3 x 208V, 3~ + PE, triangle ( configuration, 15 kW, 54 A
Technical specification:
Nominal voltage/wattage of one IR lamp : 230 V/750 W
Reduction of maximum heating rate (see pos. 1) due to reduced power
Power RSS-160 EU
230 V, 50...60 Hz, P+N+PE, 2.4 kW
Power RSS-160 JAPAN
200 V, 2~ + PE, 2.0 kW
Power RSS-160 USA
115 V, P + PE, 2.4 kW, 20 A
Notes:
1) Nominal voltage/wattage of heater cartridge: 115 V/400 W
2) Maximum current: 20 A
Power RSO-200 EU
Electrical power supply:
3 x 400 V, 3~ + N + PE, 11 kW, star (Y configuration, 3 x 16 A
Nominal IR lamp voltage: 230 V
Power Japan RSO-200
3 x 200 V, 3~ + PE, 50-60 Hz, 12 kVA, max. 35 A
Technical specification:
Nominal power/voltage of IR heater: 1000 W/ 200 V
Total number of IR heaters: 12 pcs. (bottom IR lamp field)
Power RSO-200 USA
3 x 208 V, 3~ + PE, 10 kW, triangle configuration (), 27 A
Nominal voltage of IR heater: 230 V
Power RSO-300 EU
Electrical power supply: 3 x 400 V, 3~ + N + PE, 18 kW, star (Y) configuration, 3 x 32 A
Power RSO-300 US
3x208V,3~+PE, 20 kW
Power RSO-300 Japan
3 x 200V, 3~ + PE, D (triangle) configuration, 24 kW,
ZrOx sensor based atmospheric oxygen analyzer
Technical specification:
Measurement range of oxygen (O2) concentration: 0...1000 ppm (= 0.1 Vol-%)
Operational pressure: atmosphere
Values of oxygen concentration in process chamber can be displayed on touch panel of base system and can be logged into process data (when option is checked in menu "datalogger")
Sensor element: miniaturized Zirconium Dioxide plate operated at elevated temperature that is controlled by a platinum resistor
Portable residual gas concentration measurement for oxygen traces in ppm and ppb range
Technical specification:
Power supply voltage: 230 V AC
Temperature extension up to 500 °C / instead of an aluminium plate a black chromium coated copper plate will be used as heating plate
Reduction of maximum ramp up rate to 90 K/min (= 1.5 K/sec)
Additional thermocouple with monitoring/logging function (RSS-210-S only)
Technical specification:
Maximum number of additional (flexible) thermocouples is two (2).
Temperature extension up to 500 °C (with Ni plated copper plate instead of aluminium plate)
Upgrade of RSS-210-S hinged cover with large viewport (150 mm diameter)
Integrated Formic Acid Module with separate MFC for carrier gas (N2)
Technical specification:
The reflow solder system is upgraded with an additional process gas line including a dedicated mass flow controller (MFC) for nitrogen gas (maximum flow: 5 Nlm (Normliter/minute)) as carrier gas for formic acid.
Formic Acid Module integrated but sharing the existing N2 gas line
Technical specification:
Process chamber will be upgraded by an interlock pin which prevents unintended opening of hinged cover during running process.
automatic refilling system of formic acid (only in combination with either option FAII or FAIII)
Universal safety labor hood , Size L
Technical specification:
Weight: about 175 kg (including service cart, without UHE and gas box)
Extended holding times for RTP-100, RTP-150 and RTP-200 systems
Technical specification:
1) Applicable to RTP-150 and RTP-200 based systems with option RTP-HT-150 and RTP-HT-200, respectively
2) Applicable to RTP-100 based systems
3) Type N (NiCrSi-NiSi) thermocouple instead of type K (NiCr-Ni) thermocouple as reference thermocouple
4) Enhanced mechanical stability
5) Maximum hold times (RTP-100): 10 min @ 1200 °C; 30 min @ 1100 °C; 1h @ 1010 °C
6) Maximum hold times (RTP-150, RTP-200): 3 min @ 1200 °C; 6 min @ 1100 °C; 20 min @ 1010 °C
7) Requires very powerful cooling water system: CAB-UHE (water tank with 70 l volume) or WC IV (10 kW cooling capacity)
Integrated switch box for vacuum pump and chiller
Technical specification:
Free of charge in case that vacuum pump is purchased through UniTemp GmbH
RTP-EP-200 with ramp up rate 100K/sec (power x2)
Extension of maximum temperature of RTP-150 system (pos. 1) from 1000 °C to 1200 °C
Technical specification:
Tip of thermocouple wire located in quartz glass tube for preventing direct contact with Si wafer
Upgrade of RSO-210 reflow solder oven with additional top IR lamp field
Technical specification:
Change in electric power supply from 400V/16A to 400V/32A (3~ + N + PE)
Heated cover for use with flux for avoiding condensation of flux
Adaption to lite overpressure (0.2 bar relative pressure)
Technical explanation:
Modification of VSS-450-300 system (pos. 1) for vacuum and lite overpressure (pressure range 2...1200 hPa absolute) in process chamber
Modification of VSS-450-300 system (pos. 1) for overpressure (3 bar = 0.3 MPa absolute pressure, 2 bar = 28 psi relative to STP) in process chamber
Pressure sensor suited for both vacuum (1000 ... 2 mbar absolute) and overpressure (0 ... 2 bar relative)
Top Heat (24 lamps) arranged in crossed alignment
Technical specification:
Additional B32 power supply connector at rear side of VSS-450-300 system (pos. 1)
Water cooled graphite heating plate for VSS
Technical specification:
According to technical drawing 0126_0835_Druckkammer-Heizplatte
Quartz glass frame surrounding VSS heating plate (4parts)
Technical specification:
Size: 350 mm x 350 mm x 3mm (W x D x H), with square cutout for heating plate
Separation plate in top cover of VPO-1000-300 system (pos. 1)
Technical specification:
Thickness: 3 mm
Replacement of heating plate (made of isostatic graphite) of VSS-450-300
system (pos. 1) by heating plate made of Ni coated copper
Limitation of maximum temperature to 350 °C
VPO/VSS-ExOH extended opening height 200 mm -> 300 mm
Chamber made of stainless steel (VA 1.4305) polished, instead of aluminium, 50 mm
Option to lift single wafers (diameter 150 mm, 200 mm or 300 mm) from quartz glass holder or from heating plate
Technical specification:
Lift pin operation can be executed by manual control (push buttons on front panel) or through external control interface
Quartz tray for support of single 150 mm dia wafer in RTP-150/RTP-150-HV system
Technical specification:
According to technical drawing 0015_0966
Quartz tray for support of graphite susceptor in RTP-150/RTP-150-HV system
Technical specification:
According to technical drawing 0015_0969
Quartz tray for support of single 100 mm dia wafer in RTP-100/RTP-100-HV system
Technical specification:
According to technical drawing 0081_0500
Quartz tray for support of graphite susceptor in RTP-100/RTP-100-HV system
Technical specification:
According to technical drawing 0081_0000
Susceptor suitable for RTP-100 system (pos. 1)
Technical specification:
Reduction of ramp up and cool down rate to about 10 K/sec due to thermal mass of susceptor
Susceptor suitable for RTP-150 system (pos. 1)
Technical specification:
Reduction of ramp up and cool down rate to about 10 K/sec due to thermal mass of susceptor
Susceptor suitable for RTP-200 and VPO-1000-300 vacuum process ovens
Technical specification:
Available sample area: 206 mm x 206 mm
Susceptor for use in VPO-1000-300 vacuum process oven
Technical specification:
Reduction of ramp rate (to about 10 K/sec) and of ramp down rate due to thermal mass of susceptor
Frame suitable for support of single 200 mm diameter wafer in VPO-1000-300 system
Technical description:
Individual holders for different wafer diameters (150 mm, 200 mm, 300 mm)
Quartz tray for support of single 200 mm dia wafer in RTP-200/RTP-200-HV system
Technical specification:
According to technical drawing 0016_0092
Standard quarz holder integrated in door
Graphite crucible 260x260x7mm made of isostatic graphite, suitable for RSO-QH-300 quartz holder
Quartz tray for support of graphite susceptor in RSO210/RTP-210-HV system
Technical specification:
According to technical drawing 0016_0091
Susceptor suitable for RSO-210 system (pos. 1)
Technical specification:
Including sack hole providing direct contact of thermocouple with susceptor
Process chamber suitable for RTP-100 system (pos. 1)
Technical specification:
Inner dimensions: 134 mm width, 18 mm height
Process chamber suitable for RTP-100-HV system (pos. 1)
Technical specification:
Inner dimensions: 134 mm width, 18 mm height
Process chamber muffle suitable for RTP-150 system (pos. 1)
Technical specification:
Inner dimensions: 214 mm width, 40 mm height
Process chamber muffle suitable for RTP-150-HV system (pos. 1)
Technical specification:
Including mechanical adaption to high vacuum (HV) system
Process chamber muffle suitable for RTP-200-HV / RSO-210-HV system
Technical specification:
Inner dimensions: 231 mm width, 40 mm height
Adaption of RTP-150 system (pos. 1) to glovebox
Technical description:
A Media Interface Plate (e.g. manufactured from high-pressure laminate like Trespa) replicated the connections located at rear side of RTP-150 system (pos. 1): electric power supply (3 x 400 V, 32 A), cooling water (10 mm, 12 mm), one process gas line (N2), CDA (compressed dry air), vacuum (DN 16 KF), gas outlet (DN 16 KF) and network. On both sides of this Media Interface Plate suitable connectors are located. Scope of delivery includes all cables (electric power, network), tubes (cooling water, N2, CDA) and pipes (vacuum, gas outlet) required for connecting the RTP-150 system with inner side of Media Interface Plate (inside the Glovebox). The cables and tubes required for the outside of glovebox are scope of delivery of RTP-150 system.
Dimensions: to be determined after purchase order!
Extension of maximum temperature of RTP-100 system (pos. 1) from 1000 °C to 1200 °C
Technical specification:
Holding time depends on water cooling system
Ramp up rate: T < 1000 °C: up to 150 K/sec
Ramp up rate: 1000 °C < T < 1200 °C: up to 100 K/sec
Maximum temperature: 1200 °C (for a maximum of 30 sec)
Maximum hold times: 60 sec @ 1100 °C; 3 min @ 1000 °C
Temperature control by thermocouple (type N, NiCrSi - NiSi) with temperature resistant sheath material
Tip of thermocouple wire located in quartz glass tube for preventing direct contact with Si wafer (not with use of graphite susceptor!)
Extension of maximum temperature and of maximum holding time of RTP-100 system (pos. 1)
Technical specification:
Increase of maximum temperature from 1000 °C to 1200 °C
Holding time depends on water cooling system
Maximum temperature: 1200 °C (for a maximum of 90 sec)
Maximum hold times: 180 sec @ 1100 °C; 10 min @ 1000 °C
Temperature control by thermocouple (type N, NiCrSi - NiSi) with temperature resistant sheath material
Tip of thermocouple wire located in quartz glass tube for preventing direct contact with Si wafer (does not apply for graphite susceptor which offers sack hole for placement of TC tip)
Adding of color signal tower with adjustable acoustic signal level to VSS-450-300 system (pos. )
Technical specification:
Signal tower located at rear side of process system
Indication of system status by visual and acoustical signals
Color scheme: RED (permanent): Error; YELLOW (blinking): Warning; YELLOW (permanent): process running/manual mode; GREEN (blinking): Process finished; GREEN (permanent): standby (start screen)
Level of acoustic signal can be adjusted 0...100% using a potentiometer screw located inside the siren element
Doubling of total power and extension of maximum temperature of RTP-150 system (pos. 1)
Technical specification:
Increase of total power of RTP-150 system to 2 x 21 kW (requires second power supply cable 3 x 400 V, 32 A)
Increase of maximum temperature from 1000 °C to 1200 °C
Holding time depends on water cooling system
Ramp up rate: T < 1000 °C: up to 150 K/sec
Ramp up rate: 1000 °C < T < 1200 °C: up to 100 K/sec
Maximum temperature: 1200 °C (for a maximum of 90 sec)
Maximum hold times: 180 sec @ 1100 °C; 10 min @ 1000 °C
Temperature control by thermocouple (type K) with temperature resistant sheath material
Tip of thermocouple wire located in quartz glass tube for preventing direct contact with Si wafer
Safety cover option for VSS system
Technical description:
This option includes enabling/disabling of integrated OPEN/CLOSE push buttons located at front panel of VSS-450-300 system required for opening/closing of top cover of VSS system using potential free signals.
Case 1: Pin 1 - Pin 2 open -> OPEN/CLOSE push buttons on VSS system are disabled.
Case 2: Pin 1 - Pin 2 close -> OPEN/CLOSE push buttons on VSS system are enabled.
The physical interface of this option is based on 6 pin interface of option VPO/VSS-RC (remote control) and is located at left side of VSS system.
quartz glass separation plate in top cover |
The vacuum process systems and reflow solder systems contain long term engineering know how at highest level. By continued advancement and improvements the systems comply with all technical requirements. By use of high quality components (stainless steel, quartz glass, graphite) semiconductor requirements are completely met.
Nearly all parts are manufactured in our own workshop. Software development is controlled by us. These prerequisites provide highest flexibility with regard to lead time and customer specific requirements.
A long life time of vacuum process ovens and reflow solder systems is reached by clever consumption of resources (electric power, cooling water, process gases, CDA). Regular maintenance and a sophisticated system design ensure trouble free operation for a long term.
All vacuum process ovens and reflow solder systems are cold wall oven in which only a small thermal mass has to be heated up and cooled down. For operation of these systems a cooling water supply (15…20 °C, 5 bar, deionised water without copper particles) is required. For reduction of cooling water consumption and for protection of cooling channels the chassis temperature is permanently monitored. Cooling water will be used only if required.
Reflow solder systems: The heating plate is heated by IR radiation. Thermocouples integrated into heating plate provide the temperature value to process control so that the defined temperatur profile can be performed.
RTP systems: The single wafer or susceptor (graphite plate) absorbs a fraction of radiation emitted by IR heater. The pulsed operation of IR heater allows for an extended life time when compared to systems running at full-load operation.
Compact reflow solder systems with small heated area are heated by heater cartridge. By doing so tabletop units with single phase power supply (230 V, 16 A) can be produced.
Inert gases like nitrogen or Argon are used in order to perform thermal process in a reproducible environment (free of oxygen gas). In addition to MFC controlled standard process gas line for nitrogen (N2) gas our systems can be upgraded with up to three MFC controlled process gas lines.
Formic acid (FA) is used for flux free (flux less) solder processes. Nitrogen (N2) gas serves as carrier gas which absorbs traces of FA in a dedicated FA module. In process chamber formic acid causes reduction (removal) of native oxide layer as well as improved wetting of solder material.
All standard systems can be evacuated down to a pressure of 10-3 hPa. Evacuation of process chamber causes removal of air constituents (nitrogen gas, oxygen gas) and humidity (water vapor). In this way reproducible process conditions can be realised.
Reflow solder processes can be observed through the viewing window (in hinged cover or at front side). The observation allows determining melting point of lot (liquidus) and - if necessary - interaction on program run.
Overpressure (p > 1 bar) can assist the reflow solder process for reduction of voids (area between metal surfaces not covered by solder). Simultaneously splashing of solder material will be drastically reduced.
Pure hydrogen gas (100% H2) is an effective way for reduction of native oxide layers. UniTemp GmbH offers suitable H2 modules as well as safety devices for proper and safe operation with pure hydrogen gas.