WB-Series

UniTemp's wire bonders are versatile, semi-automatic systems designed for research and development, prototyping, and small-batch production. They feature three motorized axes and combine excellent ergonomic design with high functionality and flexibility.

UniTemp combines absolute precision and high-tech features with ease of use. Thanks to effortless tool changes, the WB systems are suitable for ball, wedge, bump, and ribbon bonding. The compact benchtop units are easy to transport and set up due to their light weight. With the optional accessories, our wire bonders can be easily adapted to specific requirements.