Hot plates

UnitTemp heating plates are ideal for soldering flat components such as printed circuit boards, SMD components, or metallic substrates. The uniform temperature distribution ensures low-stress heating and reproducible solder joints.

Optional features

• Programmable heating plate for precise temperature control (ramp-up, dwell times, cool-down phases)
• Vacuum suction of the substrate for a secure hold during the soldering process
• Lift pins for easy positioning and removal of delicate components

For solid or heat-retaining components, our heating plates offer an efficient solution for preheating heavy parts to create stable and reliable soldered or joined connections. Preheating reduces thermal stresses and increases process reliability.

Optional features

• Higher heating power for heavy or thick-walled components
• Programmable temperature profiles for controlled heating
• Lift pins for safe handling of heavy components

UnitTemp heating plates can be used in microelectronics, semiconductor technology, and laboratory settings to cure photoresists. They ensure uniform temperature distribution across the entire work surface. Precise temperature control guarantees consistent layer quality and reproducible results.

Optional features

• Programming function for exact process parameters
• Vacuum suction for secure and flat substrate positioning

When curing epoxies, adhesives, or potting compounds, constant temperatures and defined time profiles are crucial. Our heating plates ensure stable processes.

Optional features

• Programmable heating plates for time- and temperature-dependent curing processes
• Vacuum clamping for sensitive or small components
• Lift pins for gentle removal after curing