History

A lot has happened over the years, and we've made a name for ourselves. We now serve a distinguished client base and have built up an extensive network of dealers around the globe.

2000
Founding of UniTemp GmbH

2002
Development of the “Model RSS” mini soldering oven and the first wafer oven, “Model UTP”
2003
Construction of the company’s own production and office building
2004
Development of a wire bonder
2006
Development of the “UTP-L” soldering furnace up to 650 °C 

2007

Development of a heating plate series: chucks and heating plates
2012
Development of the VSS vacuum soldering furnace 

2013
Development of the VPO vacuum annealing furnace
2014
Development of the high-vacuum sealer for MEMS
2015
We expand and move to a 1,000-square-meter production facility
2016

Further development of the RTP annealing furnace
2017
Purchase of a brand-new 5-axis milling machine for the production of machined parts
as well as a waterjet cutting machine for processing sheet metal and glass
2018
Equipping the furnaces with SIMATIC® control systems and touch screens
2020

Investment in a second 5-axis milling machine

2022
The RTP-200 for 8" wafers is launched
2023
The RSS-160-SC Compact with a new design!
Purchase of a 3D printer

2024
Expansion of the production area to 1,400 square meters
2025
We celebrate our company’s 25th anniversary.
New development of the VSS-620 for substrate sizes up to 600 x 600 mm

Further development of the RTP furnace for high-temperature SiC

Further development of the RSS-SC series: introducing the new RSS-310-SC

Purchase of a wafer measurement system
2026
Newly developed WB-300-U wire bonder, optionally available with a 13“ or 16” tablet, new software, ribbons, etc.