VSS Series

Vacuum soldering processes, even in contaminated environments

UniTemp's VSS series offers solutions for a variety of soldering processes using vacuum, high vacuum (up to 10-6 hPa), or negative pressure. It is ideal for research and development or for cost-effective, high-throughput production. The units can also be integrated into existing production lines.

Depending on the model, substrates ranging from 300 x 300 mm to 620 x 620 mm and up to 75 mm in height can be processed. Substrates are held in place using a graphite plate (other mounting options available upon request). Rapid vacuum attainment to 10-3 hPa and precise heating rates ensure short process times. Thanks to the gas-tight separation of the chamber from the lamp arrays, the VSS units are also suitable for processes involving a risk of contamination, among other applications. The chamber walls can additionally be equipped with custom feedthroughs, e.g., for sensors. Operation is controlled via the integrated touch panel. The SIMATIC® controller ensures easy handling and profile creation.

  • Precise heating and rapid cooling rates
  • Heating via infrared emitters; vacuum up to 10-3 hPa (optional: 10(sup:-6) hPa)
  • Temperature up to 450 °C (optional: up to 650 °C)

  • Up to 4 gas lines (mass flow controllers/MFCs)
  • SIMATIC® controller with touch panel
  • 50 programs, each with 50 steps, can be stored

  • Floor heating

  • Compact footprint
  • 
Remote control available

  • 3 programmable heating zones
  • Chamber components are easy to clean
  • Soldering processes with and without flux
  • Operation with inert gas, oxygen, forming gas, and formic acid
  • Lead-containing and lead-free SMT reflow soldering
  • Baking of resistive pastes
  • Wafer bumping and melting of solder balls
  • Flip chip
  • Hermetic encapsulation of packages
  • Processing of high-power LED modules
  • IGBT/DBC
  • Die attach

Reflow soldering ovens in comparison

Vacuum up to 1x10-3 hPa RSO-210 RSO-300 VSS-300 VSS-620
Vacuum up to 5x10-6 hPa Check Check Check Check
Max. substrate size 210x210 mm² 300x300 mm² 310x310 mm² 600x600x70 mm²
max. Temperature 650 °C 650 °C 450 °C 450°C (600°C opt.)
Chamber height 40 mm 40 mm 75 mm 75 mm
Max. ramp up rate 10 K/sec 10 K/sec 150 K/min 120 K/min
Max. ramp down rate Up to 200 K/min Up to 200 K/min Up to 200 K/min T=450°C > 350°C: 20K/min
Process gas line Mass Flow Controller
5 nlm Nitrogen Mass Flow Controller
5 nlm Nitrogen Mass Flow Controller
5 nlm Nitrogen Mass Flow Controller
40 nlm Nitrogen
Controller SIMATIC 7“ touch p. SIMATIC 7“ touch p. SIMATIC 7“ touch p. SIMATIC 12“ touch p.
Dimension (WxDxH) 505x525x570 mm 578x496x570 mm 550x690x890 mm 900x900x1535 mm
Weight 60 kg 70 kg 120 kg 480 kg

Available options

Options RSO-210 RSO-300 VSS-300 VSS-620
Extended Chamber height -EH - - 120 mm On request
Temperature extension -HT 1000 °C On request 600 °C On request
Formic acid module with separate gas line incl. Interlock (external) FA I Check Check - -
Formic acid module with additional separate gas line (internal) FA II - - Check Check
Formic acid module with shared gas line incl. Interlock FA III - - Check Check
Formic acid module with automatic refill station FA IV - - Check Check
Oxygen analyzer (not tolerant against H2 traces) Ox I Check Check Check Check
Add. Gas lines with Mass flow Controller MFC Max. 4 pcs Max. 4 pcs Max. 4 pcs Max. 4 pcs
Add. Flexible thermocouple with external conn. TC I Max. 1pc Max. 1 pc Max. 4 pcs Max. 4 pcs
Add. Flexible thermocouple with internal conn. TC II Max. 1pc Max. 1 pc Max. 4 pcs Max. 4 pcs
Vacuum up to 3 hPa VAC I Check Check Check Check
Vacuum up to 10-3 hPa VAC II Check Check Check Check
Vacuum up to 10-6 hPa HV Check Check Check Check

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