Bonding

In chip-to-package connections (packaging), the electrical connection between the silicon chip and the lead frame or substrate is established. In traditional integrated circuits (ICs), each bond pad on the chip is connected to a lead on the package. Typical methods include ball-wedge bonding, usually with gold wire, and wedge-wedge bonding, which is often performed with aluminum wire.

WB-Series (Wire bonder)

In power electronics assembly and interconnection technology, robust, high-current electrical connections are created. In IGBT and MOSFET power modules, thick aluminum wires connect the power semiconductors to the substrate or the electrical contacts, ensuring reliable current transmission.

WB-Series (Wire bonder)

In sensor and MEMS manufacturing, wire bonding enables the precise and mechanically gentle connection of sensitive micromechanical structures. The process is particularly well-suited for pressure, acceleration, and gyroscope sensors, where reliable electrical connections without unnecessary mechanical stress are crucial.

WB-Series (Wire bonder)

In optoelectronics and photonics, wire bonding is used to establish electrical connections between chips in laser diodes, LEDs, and detectors. High-precision positioning is crucial in this process to avoid compromising the optical alignment and to ensure reliable operation of the components.

WB-Series (Wire bonder)

Our equipment enables fast and flexible chip bonding for testing, laboratory applications, and research purposes. It is particularly well-suited for use in university and R&D laboratories for manual or semi-automatic bonding processes to build functional prototypes and test new components and technologies.

WB-Series (Wire bonder)

Chip-on-Board (CoB) technology enables the direct mounting and electrical connection of unpackaged chips to printed circuit boards. It is particularly well-suited for miniaturized electronics, LED modules, and sensor boards, where compact designs and space-saving integration are critical.

Wire bonder

Our equipment makes it possible to replace or rebond damaged wires on assemblies and modules. This is particularly useful for high-quality and high-cost components, as it restores functionality and can prevent the need for a complete replacement.

WB-Series (Wire bonder)