HVS Series

High-vacuum sealer with 2 heating zones (with getter activation)

Under the model designation HVS, UniTemp has developed sealing furnaces for encapsulating MEMS under high vacuum (10-6 hPa). The High Vacuum Sealers are characterized by their compact dimensions and relatively low weight. They are suitable for laboratory benches and mass production. UniTemp thus offers a cost-effective alternative to larger systems.

The devices can process up to six packages simultaneously and reliably hermetically seal components. What makes them unique is that, by using different heating and/or cooling rates in the two process zones within a single chamber, components can be processed at different temperatures up to 450 °C prior to encapsulation.

The open design behind glass allows for continuous monitoring of the processes. Using the USB interface and the included UniSoft software, any number of programs can be easily created and saved.

  • For 6 components (adapters)
  • Substrate size from 16 mm to 42 mm in diameter
  • Component separation during thermal processing in two temperature zones
  • Temperature in the lower heating zone up to 450 °C (optional up to 600 °C), in the upper zone up to 200 °C
  • Heating and cooling rate: 20 K/min (under vacuum)
  • Vacuum-compatible to 10-6 hPa, including pump, slide valve, and vacuum measurement
  • USB interface, including UniSoft software
  • Sealing and thermal encapsulation of MEMS (microelectromechanical systems)
  • Getter activation (deposition of reactive material placed within a vacuum system)

HVS models in comparison

2Z-HVS-100 2Z-HVS-200
Heated area 100 mm diameter 200 mm diameter
Adapter (Qty) max.6 pcs max. 6 pcs
Max. substrate size 16 mm dia. (max. size) 42 mm dia. (max. size)
Vacuum capability 10-6 hPA (pump included) 10-6 hPA (pump included)
Temperature max. bottom: 450 °C
top: 200 °C		 bottom: 450 °C
top: 200 °C
Temp. unifomity
Ramp up rate 20 K/min (in vacuum) 20 K/min (in vacuum)
Ramp down rate 20 K/min (in vacuum) 20 K/min (in vacuum)
Flow Controller Mass Flow Controller Mass Flow Controller
Cooling Chamber Water cooled Water cooled
Cooling Hot Plate Water cooled Water cooled
Controller SIMATIC® SIMATIC®
Dimension oven 200 x 500 x 470 mm 805 x 500 x 820 mm
Weight 24 kg + Pump 105 kg + Pump
Installation 230 V AC, 1P, 50 - 60 Hz
max. 16 A, 3,2 kW		 230/400 V AC, 3P, +N,
50 - 60 Hz, max. 3 x 16 A, 9 kW

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