Think big. Solder with precision. New dimensions in vacuum reflow.
The new VSS-620 – our latest development for substrates up to 600 × 600 mm²
The demands placed on modern power electronics, semiconductor technology, and sophisticated electronic assemblies are constantly growing. Larger substrates, more complex material combinations, and the highest quality requirements for solder joints call for high-performance and reliable process solutions.
With the new VSS-620, UniTemp has developed a vacuum reflow system that meets precisely these requirements.
With a maximum substrate size of 600 × 600 mm², the VSS-620 significantly expands the capabilities of the existing UniTemp VSS series and sets new standards in terms of process area.
The system is currently in the final stages of development and testing. Completion and final process validations are imminent.
600 × 600 mm² – a whole new scale
The VSS-620 was developed specifically for applications that focus on large substrates and demanding thermal processes.
The generous process area enables the processing of substrates up to 600 × 600 mm², thereby opening up new possibilities for:
- Power electronics and power semiconductor packaging
- Semiconductor and wafer technology
- Demanding soldering processes with large substrates
- Research and development
- Prototype manufacturing and industrial applications
However, size is not the only factor. What matters most is the interplay of controlled temperature regulation, high-performance vacuum technology, and customizable process conditions.
High-Performance Technology for Demanding Processes
The VSS-620 combines various technical approaches to ensure reproducible process conditions even with large substrates.
The combination of high heating capacity, high-performance vacuum technology, and controlled cooling lays the foundation for demanding thermal processes.
Developed with UniTemp Engineering Expertise
As with all UniTemp systems, the VSS-620 focuses on quality, flexibility, and a well-thought-out design.
Development and manufacturing are carried out drawing on many years of experience in thermal process technology. Software development is also handled entirely in-house by UniTemp.
This enables quick coordination, high flexibility, and the ability to specifically address customer-specific requirements.
Made in Germany – designed for demanding thermal processes.
The VSS-620 is almost there!
Our new product is currently undergoing the final stages of development and testing. The concluding tests and process validations are just around the corner.
We look forward to soon presenting you with a system that expands the possibilities of large-format vacuum reflow technology.
Do you already have a specific application in mind, or would you like to learn more about the new VSS-620?
Get in touch with us! We’d be happy to provide you with information on the current state of development and the planned applications.
Contact us at sales@unitemp.de or use our Inquiry Form